نتایج جستجو برای: copper alloy

تعداد نتایج: 133138  

Journal: :Applied and environmental microbiology 2012
Robert Hong Tae Y Kang Corinne A Michels Nidhi Gadura

Copper alloy surfaces are passive antimicrobial sanitizing agents that kill bacteria, fungi, and some viruses. Studies of the mechanism of contact killing in Escherichia coli implicate the membrane as the target, yet the specific component and underlying biochemistry remain unknown. This study explores the hypothesis that nonenzymatic peroxidation of membrane phospholipids is responsible for co...

Journal: :Brazilian dental journal 2004
Andréa Gonçalves João Manuel Domingos de Almeida Rollo Marcelo Gonçalves Francisco Haiter Neto Frab Norberto Bóscolo

This study evaluated the performance of aluminum-copper alloy filtration, without the original aluminum filter, for dental radiography in terms of x-ray energy spectrum, air kerma rate and image quality. Comparisons of various thicknesses of aluminum-copper alloy in three different percentages were made with aluminum filtration. Tests were conducted on an intra-oral dental x-ray machine and wer...

Journal: :international journal of iron & steel society of iran 2005
m. karaminezhaad e. kordzadeh s. ebrahimi

the openings of copper converter in sarcheshmeh copper complex in iranis made of a heat resisting austenitic steel (fe-25cr-12ni) and many failures have been reported. understanding the failure mechanism of the alloy helps to develop better alloys for similar complex environments. samples of as-cast alloy and those taken from failed ones were examined. optical microscopy (om), x-ray diffraction...

Journal: :مجله دندانپزشکی 0
کاظم خسروی k. khosravi پروانه بهرامی اسفرجانی p. bahrami esfarjani

the microleakage of cinaally amalgam, manufactured by dr faghihi co. which is a high copper alloy and fine-cut amalgam was evaluated by radioisotope agents. the microleakage of cinaally amalgam was compared with sybraloy amalgam, manufactured by sybron/kerr co. which is a high copper alloy and spherical shape amalgam and is known as a standard amalgam alloy. the results showed that there is no ...

2002

As the electronics industry begins to focus upon the tin-silver-copper family of alloys as a viable replacement for tin-lead solders, research needs to be done to determine if any particular alloy is best suited for the broadest range of applications. The tin-silver-copper family of alloys has earned a great deal of positive response from various industry consortia and organizations in recent y...

Journal: :Infection control and hospital epidemiology 2013
Cassandra D Salgado Kent A Sepkowitz Joseph F John J Robert Cantey Hubert H Attaway Katherine D Freeman Peter A Sharpe Harold T Michels Michael G Schmidt

OBJECTIVE. Healthcare-acquired infections (HAIs) cause substantial patient morbidity and mortality. Items in the environment harbor microorganisms that may contribute to HAIs. Reduction in surface bioburden may be an effective strategy to reduce HAIs. The inherent biocidal properties of copper surfaces offer a theoretical advantage to conventional cleaning, as the effect is continuous rather th...

Journal: :American journal of infection control 2011
Anna L Casey Tarja J Karpanen Debra Adams Peter A Lambert Peter Nightingale Lisa Miruszenko Tom S J Elliott

A clinical study was undertaken to compare the surface microbial contamination associated with pens constructed of either a copper alloy or stainless steel used by nurses on intensive care units. A significantly lower level of microbial contamination was found on the copper alloy pens.

2012
Arne Kloke Christian Köhler Ramona Gerwig Roland Zengerle Sven Kerzenmacher

Cyclic electrodeposition of platinum and copper enables the fabrication of high surface area electrodes (roughness factors of >3000) by multiple alternation of alloy co-deposition and dealloying of copper from the just-fabricated alloy layers. The underlying processes, resulting electrode structures, and their applicability to potentially implantable glucose fuel cells are discussed.

2014
Y. Yildiz M. M. Sundaram K. P. Rajurkar M. Nalbant

In this study, beryllium-copper alloy was subjected to around -150° F for cold treatment and to around -300° F for cryogenic treatment and the effects of these cold and cryogenic treatments on the machinability of beryllium-copper workpieces in electro discharge machining have been investigated. Experimental results showed about 20-30 % increase in material removal rate of cold and cryogenic tr...

2016
Tao-Hsing Chen Jian-Hong Wu

The deformation behavior and fracture characteristics of NiAl intermetallic alloy containing 5~7 at% Cu are investigated at room temperature under strain rates ranging from 1 ˆ 10 ́3 to 5 ˆ 103 s ́1. It is shown that the copper contents and strain rate both have a significant effect on the mechanical behavior of the NiAl alloy. Specifically, the flow stress increases with an increasing copper con...

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